Shenzhen Wisdomshow Technology Co.,ltd
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Make PCB positioning folding welding Full Automatic BGA Rework Sation WDS-800
Specification
| Max PCB Size | W650*D610mm |
| PCB Thickness | 0.5-8mm |
| BGA Size | 1*1-80*80mm |
| Min.ball pitch | 0.15mm |
| Max Weight of BGA | 150g |
| Placement precision | ±0.01mm |
| PCB Locating Way | Outer or location hole |
| Temperature Control | K-type thermocouple,close loop control |
| Lower Heating Power | Hot air 1200W |
| Upper Heating Power | Hot air 1200W |
| Bottom pre-heating | IR5000W |
| Power Supply | (Double Phase)220V,50/60Hz |
| Machine Dimension | L700*W1000*H950mm(without frame) |
| Machine Weight | 140kg |
Qutstanding performance features
HD optical alignment and interlligent control
The integrated design of hot air head and mounting head has the functions of automatic mounting, automatic welding and automatic disassembly. High precision K-type thermocouple(KSENSOR) Closed Loop control, up and down independent temperature measurement, temperature control accuracy up to ± 1 degree, Over-temperature protection alarm function, software encryption and anti-stay function.
The X/Y/Z axis is automatically shifted
The upper temperature zone is controlled by the joystick servosystem, X and Y are automatically controlled by the motor movement mode, so that the alignment is fast and convenient, and the speed can be controlled.
Vacuum adsrption and preheating platform
The upper heating head is equipped with a vacuum suction pipe for chip adsorption. The bottom preheating platform adopts imported excellent heating materials(infrared gold-plated light tube)+anti-flash thermostatic glass(temperature resistance up to 1800°C). The preheating area is up to 500*420mm. The preheating platform, splint device and cooling system can be moved as a whole in the X direction. Make PCB positioning and folding welding more safe and convenient.